发明申请
- 专利标题： Parts combining structure, and electronic apparatus
- 专利标题（中）： 零件组合结构和电子设备
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申请号： US11818472申请日： 2007-06-13
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公开(公告)号： US20070293005A1公开(公告)日： 2007-12-20
- 发明人: Naoya Shigenobu , Kohei Wada , Yasuyuki Suzuki , Yosuke Miura
- 申请人： Naoya Shigenobu , Kohei Wada , Yasuyuki Suzuki , Yosuke Miura
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 优先权： JP2006-170443 20060620
- 主分类号： H01L21/8244
- IPC分类号： H01L21/8244
摘要：
A parts combining structure is provided with first part having thermoplastic projection, and a second part having through portion to insert the projection. By thermally crushing the distal end of the projection projecting from the through portion, the first part and second part are combined. The through portion of the second part include inlet opened in the outer peripheral edge of the second part. The inlet has an opening width to permit insertion of the projection.
公开/授权文献
- US07630199B2 Parts combining structure, and electronic apparatus 公开/授权日：2009-12-08
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