A method for enhancing the bonding and linear weld density along the interface of material layers deposited in accordance with an ultrasonic consolidation manufacturing process, the method comprising: initiating an ultrasonic consolidation manufacturing process; depositing a first material layer having a contact surface; reducing surface roughness of the contact surface to prepare the contact surface to receive a subsequent material layer, the step of reducing facilitating an increased percentage and quality of material contact between the first and subsequent material layers; and bonding a subsequent material layer to the contact surface of the first material layer, as prepared.