发明申请
- 专利标题： COMPLIANT ELECTRICAL CONTACTS
- 专利标题（中）： 合规电气联系
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申请号： US11856084申请日： 2007-09-17
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公开(公告)号： US20080000080A1公开(公告)日： 2008-01-03
- 发明人: William Bernier , David Eichstadt , Mukta Farooq , John Knickerbocker
- 申请人： William Bernier , David Eichstadt , Mukta Farooq , John Knickerbocker
- 主分类号： H05K3/00
- IPC分类号： H05K3/00
摘要：
A method of forming compliant electrical contacts includes patterning a conductive layer into an array of compliant members. The array of compliant members is then positioned to be in contact with electrical connection pads on an integrated circuit wafer and the compliant members are joined to the pads. Then, the supporting layer that supported the compliant members is removed to leave the compliant members connected to the pads.
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