发明申请
- 专利标题： Handler for testing packaged chips
- 专利标题（中）： 处理器用于测试封装芯片
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申请号： US11802041申请日： 2007-05-18
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公开(公告)号： US20080001145A1公开(公告)日： 2008-01-03
- 发明人: Sung Chu , Sung Park , Yong Lim
- 申请人： Sung Chu , Sung Park , Yong Lim
- 专利权人： Mirae Corporation
- 当前专利权人： Mirae Corporation
- 优先权： KR10-2006-0046516 20060524
- 主分类号： H01L23/58
- IPC分类号： H01L23/58
摘要：
A handler for testing packaged semiconductor chips includes a tray-transferring apparatus. Transferring members in the form of rods with external screw threads hold sides of the tray. The rods are rotated together to move the trays in a longitudinal direction. A driving unit rotates the rods together. The tray-transferring apparatus does not apply vibration to the tray during transit. Thus, it is possible to minimize the likelihood that chips contained in the tray are ejected due to vibration generated during transfer of the tray.
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