发明申请
- 专利标题： Printed circuit board and method for manufacturing a solderless electrical connection
- 专利标题（中）： 印刷电路板和无焊电连接的制造方法
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申请号： US11818639申请日： 2007-06-15
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公开(公告)号： US20080003892A1公开(公告)日： 2008-01-03
- 发明人: Reinhard Fassel , Thomas Goettel , Harald Hejna
- 申请人： Reinhard Fassel , Thomas Goettel , Harald Hejna
- 优先权： DE102006027748.1 20060616
- 主分类号： H01R13/42
- IPC分类号： H01R13/42
摘要：
A printed circuit board having a plurality of press-fit sockets for accommodating press-fit pins, which are insertable from the direction of a broadside of the printed circuit board with press-fit into through holes of the press-fit sockets. The method includes applying, on a section of the broadside of the printed circuit board, of an insulating protective layer, which has passage holes for the press-fit pins situated above the through holes of the press-fit sockets.
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