发明申请
- 专利标题: CORROSION RESISTANT WAFER PROCESSING APPARATUS AND METHOD FOR MAKING THEREOF
- 专利标题(中): 耐腐蚀波浪加工设备及其制造方法
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申请号: US11554590申请日: 2006-10-31
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公开(公告)号: US20080006204A1公开(公告)日: 2008-01-10
- 发明人: David M. Rusinko , Xiang Liu , Benjamin J. Olechnowicz , Victor L. Lou , Jennifer Klug
- 申请人: David M. Rusinko , Xiang Liu , Benjamin J. Olechnowicz , Victor L. Lou , Jennifer Klug
- 申请人地址: US NY Schenectady
- 专利权人: General Electric Company
- 当前专利权人: General Electric Company
- 当前专利权人地址: US NY Schenectady
- 主分类号: C23C14/00
- IPC分类号: C23C14/00 ; C23C16/00
摘要:
A wafer processing apparatus characterized by having corrosion resistant connections for its electrical connections, gas feed-through channels, recessed areas, raised areas, MESA, through-holes such as lift-pin holes, threaded bolt holes, blind holes, and the like, with the special configurations employing connectors and fillers having excellent chemical resistant properties and optimized CTEs, i.e., having a coefficient of thermal expansion (CTE) that closely matches the CTE of the base substrate layer, the electrode(s), as well as the CTE of coating layer. In one embodiment, a filler composition comprising a glass-ceramic material is employed.