发明申请
US20080006390A1 Thermal relief mechanism for combination-type heat exchangers 审中-公开
组合式热交换器的热释放机构

  • 专利标题: Thermal relief mechanism for combination-type heat exchangers
  • 专利标题(中): 组合式热交换器的热释放机构
  • 申请号: US11483785
    申请日: 2006-07-10
  • 公开(公告)号: US20080006390A1
    公开(公告)日: 2008-01-10
  • 发明人: Ken NakayamaDavid M. Scoville
  • 申请人: Ken NakayamaDavid M. Scoville
  • 主分类号: F28D1/02
  • IPC分类号: F28D1/02
Thermal relief mechanism for combination-type heat exchangers
摘要:
A multi-fluid heat exchanger (10) is provided for transferring heat between a common fluid and a first fluid in one core section (22), and between the common fluid and a second fluid in another core section (28) of the heat exchanger (10). The core sections (22,28) are located in a series arrangement with respect to the flow of the common fluid through the heat exchanger (10) by folding the heat exchanger (10), with the core sections (22,28) being connected by folded portions (20) of the header pipes (12,14) that direct the first and second fluid flows to the interiors of the core sections (22,28).
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