发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM WITH GROUND BONDS
- 专利标题（中）： 集成电路封装系统与地板
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申请号： US11766785申请日： 2007-06-21
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公开(公告)号： US20080006929A1公开(公告)日： 2008-01-10
- 发明人: Jeffrey D. Punzalan , Henry Descalzo Bathan , Zigmund Ramirez Camacho
- 申请人： Jeffrey D. Punzalan , Henry Descalzo Bathan , Zigmund Ramirez Camacho
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
An integrated circuit package system comprising: forming leads adjacent a die paddle having a die pad extension; forming a region having one of the leads depopulated for the die pad extension; and connecting an integrated circuit die to the die pad extension.
公开/授权文献
- US08062934B2 Integrated circuit package system with ground bonds 公开/授权日：2011-11-22
信息查询
IPC分类:
