发明申请
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US11822265申请日: 2007-07-03
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公开(公告)号: US20080012107A1公开(公告)日: 2008-01-17
- 发明人: Satoshi Isa , Mitsuaki Katagiri , Kyoichi Nagata , Seiji Narui
- 申请人: Satoshi Isa , Mitsuaki Katagiri , Kyoichi Nagata , Seiji Narui
- 申请人地址: JP Tokyo
- 专利权人: ELPIDA MEMORY, INC.
- 当前专利权人: ELPIDA MEMORY, INC.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2006-186823 20060706
- 主分类号: H01L23/02
- IPC分类号: H01L23/02
摘要:
Disclosed is a semiconductor memory device in which pads on a chip which are wire-bonded to lands for solder-balls of a package, respectively, are arranged on first and second sides of the chip facing to each other and are disposed on a third side of the chip as well. Four sets of the pads for data signals are respectively disposed on four regions obtained by dividing the first and second sides into the four regions. Pads for command/address signals are arranged on the third side, thereby increasing layout space for bond fingers for the data signals and achieving uniformity in wiring for data signals.
公开/授权文献
- US07875986B2 Semiconductor device 公开/授权日:2011-01-25