Invention Application
US20080014735A1 METHOD OF FORMING SEMICONDUCTOR CHIPS, THE SEMICONDUCTOR CHIPS SO FORMED AND CHIP-STACK PACKAGE HAVING THE SAME
有权
形成半导体芯片的方法，形成的半导体芯片和具有该半导体芯片的芯片堆叠封装
- Patent Title: METHOD OF FORMING SEMICONDUCTOR CHIPS, THE SEMICONDUCTOR CHIPS SO FORMED AND CHIP-STACK PACKAGE HAVING THE SAME
- Patent Title (中): 形成半导体芯片的方法，形成的半导体芯片和具有该半导体芯片的芯片堆叠封装
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Application No.: US11775120Application Date: 2007-07-09
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Publication No.: US20080014735A1Publication Date: 2008-01-17
- Inventor: Hyun-Soo CHUNG , Seung-Kwan RYU , Ju-Il CHOI , Dong-Ho LEE , Seong-Deok HWANG
- Applicant: Hyun-Soo CHUNG , Seung-Kwan RYU , Ju-Il CHOI , Dong-Ho LEE , Seong-Deok HWANG
- Applicant Address: KR Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR2006-63936 20060707
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that includes patterning a scribe line region of a semiconductor substrate to form a semiconductor strut spaced apart from edges of a chip region of the semiconductor substrate.
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