发明申请
- 专利标题： CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- 专利标题（中）： 芯片包装结构及其制造方法
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申请号： US11530165申请日： 2006-09-08
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公开(公告)号： US20080017961A1公开(公告)日： 2008-01-24
- 发明人: Chun-Hung Lin , Shih-Wen Chou , Yu-Tang Pan
- 申请人： Chun-Hung Lin , Shih-Wen Chou , Yu-Tang Pan
- 申请人地址： TW Hsinchu BM Hamilton
- 专利权人： CHIPMOS TECHNOLOGIES INC.,CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
- 当前专利权人： CHIPMOS TECHNOLOGIES INC.,CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
- 当前专利权人地址： TW Hsinchu BM Hamilton
- 优先权： TW95126496 20060720
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A manufacturing method of a chip package structure is provided. A circuit substrate having a first surface, a second surface, and a through hole connecting the first surface and the second surface is provided. A chip having an active surface and bonding pads disposed on the active surface is provided. The chip is fixed on the circuit substrate, wherein the second surface is opposite to the active surface and the bonding pads are exposed to the through hole. Bonding wires connecting the bonding pads and the first surface are formed through the through hole. A film having an opening is formed on the first surface. The bonding wires, the bonding pads, the through hole, and part of the first surface are exposed by the opening. An encapsulant is formed to encapsulate part of the active surface, the bonding wires, and part of the first surface. The film is removed.
公开/授权文献
- US07514299B2 Chip package structure and manufacturing method thereof 公开/授权日：2009-04-07
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