Invention Application
- Patent Title: Flip-chip semiconductor package and chip carrier thereof
- Patent Title (中): 倒装芯片半导体封装及其芯片载体
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Application No.: US11880467Application Date: 2007-07-20
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Publication No.: US20080017983A1Publication Date: 2008-01-24
- Inventor: Yuan-Lin Tzeng , Nai-Hao Kao , Jeng-Yuan Lai , Yu-Po Wang , Cheng-Hsu Hsiao
- Applicant: Yuan-Lin Tzeng , Nai-Hao Kao , Jeng-Yuan Lai , Yu-Po Wang , Cheng-Hsu Hsiao
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Priority: TW095126475 20060720
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
The present invention discloses a flip-chip semiconductor package and a chip carrier thereof. The chip carrier includes a groove formed around a chip-mounting area. The groove may be formed along a periphery of the chip-mounting area or at corners thereof. The groove is filled with a filler of low Young's modulus so as to absorb and eliminate thermal stress, thereby preventing delamination between an underfill and a flip chip mounted on the chip-mounting area.
Public/Granted literature
- US08207620B2 Flip-chip semiconductor package and chip carrier for preventing corner delamination Public/Granted day:2012-06-26
Information query
IPC分类:
