A digital camera module (10) includes a chip package (20) and a lens module (50) mounted to the chip package. The package includes a carrier (21), a chip (23), a plurality of wires (24), an adhesive (26) and a cover (28). The carrier has a top surface (211), and a plurality of top contacts (215) arranged on the top surface around the opening. The chip is mounted to the top surface of the carrier, and includes an active area (231) and a plurality of pads (233) disposed on a top surface thereof. The wires electrically connect each of the pads to a corresponding top contact of the carrier. The adhesive is applied to a peripheral circumference of the top surface of the chip, around the active area. The cover is adhered to the adhesive, and encloses the active area of the chip cooperatively with the adhesive.