A probe sheet or a connecting sheet with good transmission characteristics and flexibility comprising contact terminals capable of contacting at a plurality of points and in high density, without applying damages on an electrode pad which is a contact subject is provided. Further, a high-speed transmission circuit capable of designing signal wirings with aligned impedance to have wide width even with a thin insulating film is achieved to provide a probe sheet or a connecting sheet with reduced loss of high-speed transmission signals. Moreover, the transmission circuit is applied to a probe card using a probe sheet, an inspecting method of (a method of manufacturing) a semiconductor device using the same, and a connecting sheet having an excellent high-frequency characteristic.