发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING DIE STACKING
- 专利标题（中）： 集成电路封装系统，包括DIE堆叠
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申请号： US11869738申请日： 2007-10-09
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公开(公告)号： US20080029862A1公开(公告)日： 2008-02-07
- 发明人: Dario Filoteo , Tsz Ho
- 申请人： Dario Filoteo , Tsz Ho
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
An integrated circuit package system including a leadframe with an aperture formed therein. An integrated circuit package is mounted on the leadframe over or under the aperture and a die is mounted within the aperture to the integrated circuit package.
公开/授权文献
- US07619314B2 Integrated circuit package system including die stacking 公开/授权日：2009-11-17
信息查询
IPC分类:
