发明申请
- 专利标题： METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS
- 专利标题（中）： 为集成电路创建灵活连接的方法
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申请号： US11872229申请日： 2007-10-15
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公开(公告)号： US20080029889A1公开(公告)日： 2008-02-07
- 发明人: Leena Buchwalter , Russell Budd , Chirag Patel
- 申请人： Leena Buchwalter , Russell Budd , Chirag Patel
- 申请人地址： US NY Armonk 10504
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk 10504
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/44
摘要：
A method of producing flexible interconnections for integrated circuits, and, in particular, the forming of flexible or compliant interconnections preferably by a laser-assisted chemical vapor deposition process in semiconductor or glass substrate-based carriers which are employed for mounting and packaging multiple integrated circuit chips and selectively, other devices in the technology.
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