Invention Application
- Patent Title: INTEGRATED CIRCUIT PACKAGE SYSTEM
- Patent Title (中): 集成电路封装系统
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Application No.: US11462303Application Date: 2006-08-03
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Publication No.: US20080029911A1Publication Date: 2008-02-07
- Inventor: Hyung Jun Jeon , Tae Keun Lee , Sung Soo Kim
- Applicant: Hyung Jun Jeon , Tae Keun Lee , Sung Soo Kim
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC LTD.
- Current Assignee: STATS ChipPAC LTD.
- Current Assignee Address: SG Singapore
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L21/00
Abstract:
An integrated circuit package system is provided including forming a substrate with a device thereover, forming an encapsulation having a planar top surface to cover the device and the substrate spanning to an extraction side of the encapsulation, and forming a recess in the encapsulation from the planar top surface.
Public/Granted literature
- US07705475B2 Integrated circuit package system Public/Granted day:2010-04-27
Information query
IPC分类:
