Invention Application
US20080030960A1 ANISOTROPIC HEAT SPREADING APPARATUS AND METHOD FOR SEMICONDUCTOR DEVICES
失效
用于半导体器件的各向异性热传递装置和方法
- Patent Title: ANISOTROPIC HEAT SPREADING APPARATUS AND METHOD FOR SEMICONDUCTOR DEVICES
- Patent Title (中): 用于半导体器件的各向异性热传递装置和方法
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Application No.: US11872095Application Date: 2007-10-15
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Publication No.: US20080030960A1Publication Date: 2008-02-07
- Inventor: David Edwards , Thomas Fleischman , Paul Zucco
- Applicant: David Edwards , Thomas Fleischman , Paul Zucco
- Applicant Address: US NY Armonk 10504
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk 10504
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat spreading apparatus for use in cooling of semiconductor devices includes a frame having a plurality of individual cells formed therein, each of the cells configured for filling with a material of selected thermal conductivity therein. The selected thermal conductivity of material within a given one of the cells corresponds to a thermal profile of the semiconductor device to be cooled.
Public/Granted literature
- US07464462B2 Method of forming anisotropic heat spreading apparatus for semiconductor devices Public/Granted day:2008-12-16
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