Invention Application
US20080032242A1 Method of Forming Plated Product Using Negative Photoresist Composition and Photosensitive Composition Used Therein
有权
使用负光致抗蚀剂组合物和其中使用的光敏组合物形成电镀产品的方法
- Patent Title: Method of Forming Plated Product Using Negative Photoresist Composition and Photosensitive Composition Used Therein
- Patent Title (中): 使用负光致抗蚀剂组合物和其中使用的光敏组合物形成电镀产品的方法
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Application No.: US11629017Application Date: 2005-05-10
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Publication No.: US20080032242A1Publication Date: 2008-02-07
- Inventor: Yasuo Masuda , Yasushi Washio , Koji Saito
- Applicant: Yasuo Masuda , Yasushi Washio , Koji Saito
- Priority: JP2004-195034 20040630
- International Application: PCT/JP05/08846 WO 20050510
- Main IPC: G03F7/095
- IPC: G03F7/095 ; G03F7/00
Abstract:
A method is provided that enables the formation of multiple level plated products with large plating depth. A negative photoresist composition comprising (a) an alkali-soluble resin, (b) an acid generator, and (c) other components is used, and a plated product is formed by (A) a step of forming a layer of this negative photoresist composition, and then either heating or not heating, before conducting exposure; (B) a step of repeating the step (A) so that the step is performed a total of 2 or more times, thereby superimposing layers of the negative photoresist, and subsequently developing all of these layers simultaneously to form a multilayer resist pattern; and (C) a step of conducting plating treatment within this multilayer resist pattern.
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