A method of manufacturing a semiconductor device can suppress the generation of burrs when an array of integrated circuits to which a supporting member is bonded for assistance is separated into chips. The supporting member having thinned regions (or void regions which are openings in the supporting member) located correspondingly beneath the scribing lines extending between the integrated circuits is bonded by an adhesive to the back side of a semiconductor substrate on which integrated circuits are arrayed at the primary side. Then, a dicing tape is attached to the support member to secure the entire assembly, and the assembly of the integrated circuits, the semiconductor substrate, the adhesive, and the supporting member are cut along the scribing lines, and then the dicing tape is removed.