发明申请
US20080035474A1 APPARATUS FOR ELECTROPROCESSING A SUBSTRATE WITH EDGE PROFILE CONTROL
审中-公开
用于电镀具有边缘型材控制的基板的装置
- 专利标题: APPARATUS FOR ELECTROPROCESSING A SUBSTRATE WITH EDGE PROFILE CONTROL
- 专利标题(中): 用于电镀具有边缘型材控制的基板的装置
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申请号: US11877356申请日: 2007-10-23
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公开(公告)号: US20080035474A1公开(公告)日: 2008-02-14
- 发明人: You Wang , Jie DIAO , Stan TSAI , Lakshmanan Karuppiah
- 申请人: You Wang , Jie DIAO , Stan TSAI , Lakshmanan Karuppiah
- 主分类号: C25B9/00
- IPC分类号: C25B9/00
摘要:
Embodiments of the invention generally provide methods and apparatuses for electroprocessing a substrate. In one embodiment, an apparatus for electrochemically processing the substrate includes a conductive processing surface adapted for processing a substrate thereon, and a polishing head for retaining the substrate against the processing surface. At least one drive mechanism provides relative motion between the conductive processing surface and the substrate. A first electrode is disposed below the conductive processing surface and is comprised of a first material. A second electrode is disposed radially inward of the first electrode and comprised of a second material.