发明申请
- 专利标题： Light emitting diode package
- 专利标题（中）： 发光二极管封装
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申请号： US11714156申请日： 2007-03-06
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公开(公告)号： US20080035948A1公开(公告)日： 2008-02-14
- 发明人: Sang Shin , Seog Choi , Young Lee , Yong Kim
- 申请人： Sang Shin , Seog Choi , Young Lee , Yong Kim
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权： KR10-2006-0022141 20060309
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A light emitting diode package for preventing an electric short circuit among semiconductor layers and with excellent bonding strength. The light emitting diode package includes a package substrate, a light emitting diode chip bonded to an upper surface of the package substrate, and a bonding material for bonding the light emitting diode chip to the package substrate. The package substrate has a recess formed in a bonding surface thereof to accommodate the bonding material.
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