Invention Application
- Patent Title: METHOD TO MAKE LOW RESISTANCE CONTACT
- Patent Title (中): 制造低电阻接触的方法
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Application No.: US11761897Application Date: 2007-06-12
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Publication No.: US20080035950A1Publication Date: 2008-02-14
- Inventor: CHEN-FU CHU , Wen-Huang Liu , Jiunn-Yi Chu , Chao-Chen Cheng , Hao-Chun Cheng , Feng-Hsu Fan , Trung Doan
- Applicant: CHEN-FU CHU , Wen-Huang Liu , Jiunn-Yi Chu , Chao-Chen Cheng , Hao-Chun Cheng , Feng-Hsu Fan , Trung Doan
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00 ; H01L31/00

Abstract:
Techniques for fabricating contacts on inverted configuration surfaces of GaN layers of semiconductor devices are provided. An n-doped GaN layer may be formed with a surface exposed by removing a substrate on which the n-doped GaN layer was formed. The crystal structure of such a surface may have a significantly different configuration than the surface of an as-deposited p-doped GaN layer.
Public/Granted literature
- US08685764B2 Method to make low resistance contact Public/Granted day:2014-04-01
Information query
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