Invention Application
- Patent Title: Secmiconductor device and method for manufacturing a semiconductor device
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US11827041Application Date: 2007-07-09
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Publication No.: US20080036072A1Publication Date: 2008-02-14
- Inventor: Ta-Te Chou , Xiong-Jie Zhang , Xian Li , Hai Fu , Yong-Qi Tian
- Applicant: Ta-Te Chou , Xiong-Jie Zhang , Xian Li , Hai Fu , Yong-Qi Tian
- Assignee: Vishay General Semiconductor LLC
- Current Assignee: Vishay General Semiconductor LLC
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/00

Abstract:
A semiconductor device mountable to a substrate is provided. The device includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. An interlayer material is formed on the second attachment surface of the electrically conductive attachment region. The interlayer material is a thermally conductive, dielectric material. A housing at least in part encloses the semiconductor die and the interlayer material.
Public/Granted literature
- US07719096B2 Semiconductor device and method for manufacturing a semiconductor device Public/Granted day:2010-05-18
Information query
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