发明申请
US20080037199A1 MULTILAYER CAPACITOR, CIRCUIT BOARD, CIRCUIT MODULE, AND METHOD FOR MANUFACTURING MULTILAYER CAPACITOR 有权
多层电容器,电路板,电路模块和制造多层电容器的方法

MULTILAYER CAPACITOR, CIRCUIT BOARD, CIRCUIT MODULE, AND METHOD FOR MANUFACTURING MULTILAYER CAPACITOR
摘要:
A multilayer capacitor includes a laminate of ceramic layers, and a capacitor unit provided in the laminate. In the multilayer capacitor, the relationships P≧Ra and P≧W are established, wherein P represents the average projection height of first and second via conductors from the upper surface, Ra represents the surface roughness of the upper surface, and W represents an amount of curvature of the laminate. Further, the projecting portions of the first and second via conductors projecting from the upper surface are buried in first and second external electrodes, respectively.
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