发明申请
- 专利标题: MULTILAYER CAPACITOR, CIRCUIT BOARD, CIRCUIT MODULE, AND METHOD FOR MANUFACTURING MULTILAYER CAPACITOR
- 专利标题(中): 多层电容器,电路板,电路模块和制造多层电容器的方法
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申请号: US11836601申请日: 2007-08-09
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公开(公告)号: US20080037199A1公开(公告)日: 2008-02-14
- 发明人: Hidetaka FUKUDOME , Masaaki TANIGUCHI
- 申请人: Hidetaka FUKUDOME , Masaaki TANIGUCHI
- 申请人地址: JP Nagaokakyo-shi
- 专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址: JP Nagaokakyo-shi
- 优先权: JP2006-217593 20060809; JP2007-177561 20070705
- 主分类号: H01G4/12
- IPC分类号: H01G4/12
摘要:
A multilayer capacitor includes a laminate of ceramic layers, and a capacitor unit provided in the laminate. In the multilayer capacitor, the relationships P≧Ra and P≧W are established, wherein P represents the average projection height of first and second via conductors from the upper surface, Ra represents the surface roughness of the upper surface, and W represents an amount of curvature of the laminate. Further, the projecting portions of the first and second via conductors projecting from the upper surface are buried in first and second external electrodes, respectively.
公开/授权文献
- US07894202B2 Multilayer capacitor 公开/授权日:2011-02-22
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