Invention Application
- Patent Title: COMPOSITE MATERIAL, HAVING HIGH THERMAL CONDUCTIVITY AND LOW THERMAL EXPANSION COEFFICIENT, AND HEAT-DISSIPATING SUBSTRATE, AND THEIR PRODUCTION METHODS
- Patent Title (中): 具有高导热系数和低热膨胀系数的复合材料和散热基板及其生产方法
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Application No.: US11678391Application Date: 2007-02-23
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Publication No.: US20080038535A1Publication Date: 2008-02-14
- Inventor: Hideko Fukushima
- Applicant: Hideko Fukushima
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP2003-138121 20030516
- Main IPC: B32B3/26
- IPC: B32B3/26

Abstract:
A composite material having a high thermal conductivity and a small thermal expansion coefficient, which is obtained by impregnating a porous graphitized extrudate with a metal; the composite material having such anisotropy that the thermal conductivity and the thermal expansion coefficient are 250 W/mK a more and less than 4×10−6/K, respectively, in an extrusion direction; and that the thermal conductivity and the thermal expansion coefficient are 150 W/mK or more and 10×10−6/K or less, respectively, in a direction perpendicular to the extrusion direction.
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