发明申请
US20080039585A1 Thermosetting Resin Composition, Thermosetting Film, Cured Product of Those, and Electronic Component
审中-公开
热固性树脂组合物，热固性薄膜，固化产品和电子部件
- 专利标题： Thermosetting Resin Composition, Thermosetting Film, Cured Product of Those, and Electronic Component
- 专利标题（中）： 热固性树脂组合物，热固性薄膜，固化产品和电子部件
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申请号： US11719024申请日： 2005-11-09
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公开(公告)号： US20080039585A1公开(公告)日： 2008-02-14
- 发明人: Takashi Nishioka , Hirofumi Gotou , Tsunemitsu Miyata , Shin-ichiro Iwanaga
- 申请人： Takashi Nishioka , Hirofumi Gotou , Tsunemitsu Miyata , Shin-ichiro Iwanaga
- 申请人地址： JP Tokyo 104-0045
- 专利权人： JSR Corporation
- 当前专利权人： JSR Corporation
- 当前专利权人地址： JP Tokyo 104-0045
- 优先权： JP2004-326288 20041110; JP2004-346198 20041130
- 国际申请： PCT/JP05/20547 WO 20051109
- 主分类号： C08L71/02
- IPC分类号： C08L71/02
摘要：
A thermosetting resin composition of the present invention contains an epoxy resin (A), a crosslinked diene-based rubber (B) in which the content of bonded acrylonitrile is less than 10 wt %, and a curing agent (D) and/or a curing catalyst (E). A cured product obtained by curing the thermosetting resin composition is excellent in properties such as electric insulation properties and electrical properties.
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