A solid-state image pickup device including a substrate having a first face and a second face which serves as an opposite face of the first face; a solid-state image pickup element having a plurality of electrodes and a light sensing part, an opposite face of the light sensing part being bonded to the first face via a bonding agent; a plurality of wires formed over the face, first ends of the wires serving as external electrode terminals; and a connection part for electrically connecting the electrodes to the wires, wherein an endless-shaped contraction frame formed of resin larger in thermal expansion coefficient than the substrate and image pickup element is bonded to and formed on surface of the substrate located outside the light sensing part so as to surround the light sensing part, and a light sensing face of the light sensing part is warped.