An object is to improve the adhesion strength between a circuit pattern and its substrate without increasing the resistance value of the circuit pattern in preparation of a circuit pattern holding substrate. A circuit pattern formation device 100 forms, after forming a precursor circuit-pattern 12 in the surface of a dielectric thin film body 4, a circuit pattern 14 onto a target substrate 23 from the dielectric thin film body. After forming an electrostatic latent image 2 in the upper surface of the dielectric thin film body, the electrostatic latent image is exposed using an exposure unit 3 to prepare a pattern. A development apparatus 7 supplies a conductive particle dispersion solution 6 to this pattern to form a precursor circuit-pattern. By energizing the circuit pattern holding substrate 8, in which an adhesive layer 22 is formed, the precursor circuit-pattern is temporarily transferred to the circuit pattern holding substrate. The transferred precursor circuit-pattern is heated using the heater 13 to form a circuit pattern. The circuit pattern and the adhesive layer are released from the circuit pattern holding substrate, thereby transferring to the target substrate.