Invention Application
- Patent Title: HEAT SLUG FOR PACKAGE STRUCTURE
- Patent Title (中): 用于包装结构的加热片
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Application No.: US11834863Application Date: 2007-08-07
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Publication No.: US20080048304A1Publication Date: 2008-02-28
- Inventor: Cheng-cheng Liu , Jun-cheng Liu , Hsin-hao Chen , Chi-ming Chen
- Applicant: Cheng-cheng Liu , Jun-cheng Liu , Hsin-hao Chen , Chi-ming Chen
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Priority: TW095130773 20060822
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/34
Abstract:
A heat slug is provided for a package structure, including a main body and a plurality of protrusions. The main body has a surface in which at least one ditch is defined. Each protrusion is connected to and extends from the main body and has a surface in which a plurality of dimples is defined.
Public/Granted literature
- US07763959B2 Heat slug for package structure Public/Granted day:2010-07-27
Information query
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