发明申请
US20080050862A1 Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time
失效
在短时间内制造包括掩模ROM的单芯片半导体集成电路器件的方法
- 专利标题： Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time
- 专利标题（中）： 在短时间内制造包括掩模ROM的单芯片半导体集成电路器件的方法
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申请号： US11881223申请日： 2007-07-26
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公开(公告)号： US20080050862A1公开(公告)日： 2008-02-28
- 发明人: Koji Yano , Tomoki Segawa
- 申请人： Koji Yano , Tomoki Segawa
- 申请人地址： JP Tama-shi
- 专利权人： Mitsumi Electric Co., Ltd.
- 当前专利权人： Mitsumi Electric Co., Ltd.
- 当前专利权人地址： JP Tama-shi
- 优先权： JP2006-207797 20060731
- 主分类号： H01L21/77
- IPC分类号： H01L21/77
摘要：
In a state of a first semiconductor integrated circuit device on which a first semiconductor integrated circuit board including a first mask ROM and a programmable ROM are mounted, an ultimate program determined by using the programmable ROM is stored in a second ROM of a second semiconductor integrated circuit board which is substantially similar in structure to the first semiconductor integrated circuit board, thereby manufacturing a second semiconductor integrated circuit device as an ultimate product.