发明申请
- 专利标题: Modular Insulation Displacement Contact Block
- 专利标题(中): 模块化绝缘位移接触块
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申请号: US11843078申请日: 2007-08-22
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公开(公告)号: US20080050980A1公开(公告)日: 2008-02-28
- 发明人: Yakov Belopolsky , David Gutter , Richard Marowsky
- 申请人: Yakov Belopolsky , David Gutter , Richard Marowsky
- 主分类号: H01R24/00
- IPC分类号: H01R24/00 ; H01R13/46
摘要:
An insulation displacement contact block comprising a base and first, second, and third walls extending upward from the base. The first and second wall define a first wire insertion opening. The second and third wall define a second wire insertion opening. A first insulation displacement contact is disposed between the first and second wall, the first insulation displacement contact including a first side and a first edge, the first side being longer than the first edge. A second insulation displacement contact is disposed between the second and third wall, the second insulation displacement contact including a second side and a second edge, the second side being longer than the second edge. The first and second insulation displacement contacts are disposed so that the first edge faces, and is in the same plane as, the second edge. A plurality of insulation displacement contact blocks may be grouped together by a tie bar to form a strip.
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