Invention Application
- Patent Title: METHOD OF STACKING FLEXIBLE SUBSTRATE
- Patent Title (中): 堆叠柔性基板的方法
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Application No.: US11774855Application Date: 2007-07-09
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Publication No.: US20080053604A1Publication Date: 2008-03-06
- Inventor: Gi Heon KIM , Yong Hae KIM , Dong Jin PARK , Chul Am KIM , Kyung Soo SUH
- Applicant: Gi Heon KIM , Yong Hae KIM , Dong Jin PARK , Chul Am KIM , Kyung Soo SUH
- Priority: KR10-2006-0082746 20060830
- Main IPC: C09J5/00
- IPC: C09J5/00 ; B29C70/44

Abstract:
A method of stacking a flexible substrate is provided. The method includes the steps of: preparing a carrier substrate; stacking an adhesive layer on the carrier substrate; and stacking a flexible substrate having at least one image display device on the adhesive layer using a laminating or pressing method. Thus, the flexible substrate is easily fabricated without modification of conventional mass-production equipment for fabricating a display, and thereby a lightweight, thin, and compact flexible display can be realized.
Public/Granted literature
- US08038820B2 Method of stacking flexible substrate Public/Granted day:2011-10-18
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