发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- 专利标题（中）： 半导体器件及其制造方法
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申请号： US11849328申请日： 2007-09-03
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公开(公告)号： US20080054384A1公开(公告)日： 2008-03-06
- 发明人: Katsuyuki UEMATSU , Shigeru SHINODA , Kimihiro ASHINO
- 申请人： Katsuyuki UEMATSU , Shigeru SHINODA , Kimihiro ASHINO
- 申请人地址： JP Tokyo 141-0032
- 专利权人： FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
- 当前专利权人： FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
- 当前专利权人地址： JP Tokyo 141-0032
- 优先权： JP2006-238856 20060904
- 主分类号： H01L29/84
- IPC分类号： H01L29/84 ; H01L21/60 ; H01L23/495
摘要：
A lead frame which is disposed in an outer package is composed of three members. The lead frame is provided with contact electrodes, connector terminals, and conductive interconnections which are connected to the respective connector terminals. The arrangement order of the contact electrodes is such that contact electrodes are connected to the connector terminals, respectively; that is, the arrangement direction of the contact electrodes is the same as that of the connector terminals. On the other hand, the arrangement order of the contact electrodes is such that contact electrodes are connected to the connector terminals, respectively, that is, the arrangement direction of the contact electrodes is opposite to that of the connector terminals. Lead terminals of a resin cell package are connected to the contact electrodes.
公开/授权文献
- US07772658B2 Semiconductor device and method of manufacturing same 公开/授权日：2010-08-10
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