发明申请
US20080054463A1 Semiconductor apparatus and manufacturing method of semiconductor apparatus
审中-公开
半导体装置及半导体装置的制造方法
- 专利标题： Semiconductor apparatus and manufacturing method of semiconductor apparatus
- 专利标题（中）： 半导体装置及半导体装置的制造方法
-
申请号： US11882374申请日： 2007-08-01
-
公开(公告)号： US20080054463A1公开(公告)日： 2008-03-06
- 发明人: Hiroyuki Nakanishi
- 申请人： Hiroyuki Nakanishi
- 申请人地址： JP Osaka-shi
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 当前专利权人地址： JP Osaka-shi
- 优先权： JP2006-232810 20060829
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/44
摘要：
The semiconductor apparatus includes: a conductor section provided on a surface of a semiconductor chip so as to input and output an electric signal; and an external connection terminal provided on the surface of the conductor section so as to joint the conductor section to a package substrate, wherein the conductor section has a through hole provided on the surface of the conductor section and piercing a center of the surface of the conductor section, and the external connection terminal is formed along the through hole. As a result, it is possible to realize a semiconductor apparatus whose resistance against repetitive stresses and impulse is improved and which has high packaging reliability.
信息查询
IPC分类:
