发明申请
- 专利标题： Lead Pin for Mounting Semiconductor and Printed Wiring Board
- 专利标题（中）： 引脚用于安装半导体和印刷电路板
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申请号： US11572334申请日： 2005-08-30
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公开(公告)号： US20080055874A1公开(公告)日： 2008-03-06
- 发明人: Masanori Kawade , Hiroyuki Tsuruga , Makoto Ebina
- 申请人： Masanori Kawade , Hiroyuki Tsuruga , Makoto Ebina
- 申请人地址： JP Ogaki-shi, Gifu 503-0917
- 专利权人： IBIDEN CO., LTD.
- 当前专利权人： IBIDEN CO., LTD.
- 当前专利权人地址： JP Ogaki-shi, Gifu 503-0917
- 优先权： JP2004-268521 20040915
- 国际申请： PCT/JP05/15771 WO 20050830
- 主分类号： H01R9/00
- IPC分类号： H01R9/00
摘要：
A semiconductor loading lead pin that does not tilt at a time of reflow. A void is sometimes left in solder between an electrode pad and the flange of a semiconductor loading lead pin. When reflow is carried out to load an IC chip, the solder for connection is melted and at the same time, the void in the solder is expanded. The solder escapes sideway along the groove portion, and thereby a flange is not raised by the void so that the semiconductor loading lead pin is not tilted.
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