发明申请
- 专利标题： SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD
- 专利标题（中）： 半导体器件封装和制造方法
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申请号： US11852079申请日： 2007-09-07
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公开(公告)号： US20080061407A1公开(公告)日： 2008-03-13
- 发明人: Jun Yang , You Joo , Dong Jung
- 申请人： Jun Yang , You Joo , Dong Jung
- 专利权人： Integrated System Solution Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Integrated System Solution Advanced Semiconductor Engineering, Inc.
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L21/60
摘要：
A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The present invention further provides methods for manufacturing the semiconductor device package
公开/授权文献
- US07700411B2 Semiconductor device package and manufacturing method 公开/授权日：2010-04-20