Invention Application
- Patent Title: Bending Method and Machine Thereof
- Patent Title (中): 弯曲方法和机器
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Application No.: US11576735Application Date: 2004-10-05
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Publication No.: US20080066510A1Publication Date: 2008-03-20
- Inventor: Hidekatsu Ikeda
- Applicant: Hidekatsu Ikeda
- Applicant Address: JP Kanagawa
- Assignee: AMADA CO., LTD.
- Current Assignee: AMADA CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP2004-307854 20041022; JP2005-32383 20050208; JP2005-262148 20050909
- International Application: PCT/JP05/18253 WO 20041005
- Main IPC: B21D5/02
- IPC: B21D5/02
Abstract:
In a bending machine, there is provided at one back gauge abutting part (5) a plurality of contact confirmation sensors for confirming the contact thereof with a workpiece; and there is included control means driving a ram (1) on the conditions of ON of all the sensors automatically or manually specified among these contact confirmation sensors and ON of a foot pedal (6) when the workpiece is abutted.
Public/Granted literature
- US08931317B2 Bending method and machine thereof Public/Granted day:2015-01-13
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