A substrate treatment apparatus according to the present invention includes: a plate to be positioned in spaced opposed relation to one surface of a substrate and having a plurality of outlet ports and a plurality of suction ports provided in an opposed surface thereof to be opposed to the one surface of the substrate; a rinse liquid supplying unit which supplies a rinse liquid containing deionized water to the outlet ports of the plate; a suction unit which evacuates the suction ports of the plate; a drying promoting fluid supplying unit which supplies a drying promoting fluid to the one surface of the substrate to promote drying of the substrate; a substrate holding unit to be positioned on the other surface of the substrate opposite from the one surface for holding the substrate; and a supply controlling unit which controls the rinse liquid supplying unit to discharge the rinse liquid from the outlet ports toward the one surface of the substrate to seal a space defined between the one surface and the opposed surface with the rinse liquid, and controls the drying promoting fluid supplying unit to supply the drying promoting fluid to the one surface with the space between the one surface and the opposed surface kept in a liquid sealed state to replace the rinse liquid present between the one surface and the opposed surface with the drying promoting fluid.