发明申请
US20080070000A1 Circuit module with interposer and method for manufacturing the same
审中-公开
具有插入器的电路模块及其制造方法
- 专利标题： Circuit module with interposer and method for manufacturing the same
- 专利标题（中）： 具有插入器的电路模块及其制造方法
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申请号： US11888543申请日： 2007-07-31
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公开(公告)号： US20080070000A1公开(公告)日： 2008-03-20
- 发明人: Jin Suzuki
- 申请人： Jin Suzuki
- 专利权人： ALPS ELECTRIC CO., LTD.
- 当前专利权人： ALPS ELECTRIC CO., LTD.
- 优先权： JP2006-254264 20060920
- 主分类号： B32B3/10
- IPC分类号： B32B3/10 ; H01R43/00
摘要：
A circuit module includes a multilayer wiring board having a cavity portion and an interposer on which a chip part is mounted. The interposer is bonded to the multilayer wiring board so that the chip part is disposed in the cavity portion and the cavity portion is hermetically sealed. In the manufacturing process for the circuit module, a continuity test of the chip part is conducted by applying a testing voltage to the interposer before the interposer is bonded to the multilayer wiring board.
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