发明申请
US20080073034A1 Method for thermally releasing adherend and apparatus for thermally releasing adherend
审中-公开
粘合剂热释放方法和用于热脱模粘合体的装置
- 专利标题: Method for thermally releasing adherend and apparatus for thermally releasing adherend
- 专利标题(中): 粘合剂热释放方法和用于热脱模粘合体的装置
-
申请号: US11984362申请日: 2007-11-16
-
公开(公告)号: US20080073034A1公开(公告)日: 2008-03-27
- 发明人: Seiji Izutani , Michirou Kawanishi , Yukio Arimitsu
- 申请人: Seiji Izutani , Michirou Kawanishi , Yukio Arimitsu
- 申请人地址: JP Ibaraki-shi
- 专利权人: NITTO DENKO CORPORATION
- 当前专利权人: NITTO DENKO CORPORATION
- 当前专利权人地址: JP Ibaraki-shi
- 优先权: JP2001-128357 20010425
- 主分类号: B32B38/10
- IPC分类号: B32B38/10
摘要:
The invention provides a method for thermally releasing an adherend, which comprises selectively releasing one or some of a plurality of substances adhered on a thermally releasable pressure-sensitive adhesive sheet having a thermally expandable layer containing therein thermo-expandable microspheres, by partly heating the pressure-sensitive adhesive sheet using a heating unit capable of partly heating the pressure-sensitive adhesive sheet. This thermally releasing method may further involve a step of cutting the substance adhered to the pressure-sensitive adhesive sheet. In this occasion, the heating unit has a heating portion of a shape in conformity with the shape of the adherend to be released, and may be provided on at lease one of the side to which the adherend is adhered and the opposite side thereto of the pressure-sensitive adhesive sheet.
信息查询