发明申请
US20080073745A1 High-voltage MOS device improvement by forming implantation regions 审中-公开
通过形成注入区域改善高压MOS器件

High-voltage MOS device improvement by forming implantation regions
摘要:
A high-voltage semiconductor structure includes a high-voltage well region overlying a substrate, an isolation region extending from a top surface of the high-voltage well region into the high-voltage well region, a low-voltage well region having at least a portion underlying and adjoining the isolation region wherein the low-voltage well region is inside of and of a same conductivity type as the high-voltage well region, a gate dielectric on the high-voltage well region, a gate electrode on the gate dielectric, and a source/drain region of the same conductivity type as the high-voltage well region, wherein the source/drain region is spaced apart from a channel region by the isolation region.
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