An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.