发明申请
US20080075604A1 Process For The Electrolytic Treatment Of A Component, And A Component With Through-Hole
审中-公开
一种组分的电解处理方法和一个具有通孔的组分
- 专利标题： Process For The Electrolytic Treatment Of A Component, And A Component With Through-Hole
- 专利标题（中）： 一种组分的电解处理方法和一个具有通孔的组分
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申请号： US11667330申请日： 2005-09-19
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公开(公告)号： US20080075604A1公开(公告)日： 2008-03-27
- 发明人: Rene Jabado , Uwe Kaden , Ursus Kruger , Daniel Kortvelyessy , Ralph Reiche , Michael Rindler , Jan Steinbach , Peter Tiemann
- 申请人： Rene Jabado , Uwe Kaden , Ursus Kruger , Daniel Kortvelyessy , Ralph Reiche , Michael Rindler , Jan Steinbach , Peter Tiemann
- 优先权： EP04026620.7 20041109
- 国际申请： PCT/EP05/54647 WO 20050919
- 主分类号： C25D5/02
- IPC分类号： C25D5/02 ; B01J19/08 ; F01D5/14
摘要：
Electrolytic methods are used to treat large external surfaces. There is described a method for internally coating through-holes of a wall, wherein an electrolyte flows through the through-hole during the treatment and deposits material on the respective inner surface. A single electrode is being used for at least two through-holes.
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