发明申请
US20080076253A1 Adhesive Sheet,Semiconductor Device,and Process for Producing Semiconductor Device
审中-公开
粘合片，半导体装置和半导体装置的制造方法
- 专利标题： Adhesive Sheet,Semiconductor Device,and Process for Producing Semiconductor Device
- 专利标题（中）： 粘合片，半导体装置和半导体装置的制造方法
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申请号： US11576267申请日： 2004-09-30
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公开(公告)号： US20080076253A1公开(公告)日： 2008-03-27
- 发明人: Hiroshi Fukada
- 申请人： Hiroshi Fukada
- 国际申请： PCT/JP04/14356 WO 20040930
- 主分类号： H01L21/461
- IPC分类号： H01L21/461
摘要：
In the polishing head of a CMP device, the diaphragm which includes an elastic body film is fixed to a carrier plate with the diaphragm stop ring which includes a metallic material. The screw stop of the retaining ring which includes a resin material is done to this diaphragm stop ring with a screw from a lower part. A groove is formed in the under surface of a retaining ring, and the screw hole for doing the screw stop of the retaining ring is formed in the groove. By pressurizing the space sealed by a diaphragm, membrane, etc., a semiconductor wafer is pushed against a polishing pad via membrane, and CMP treatment of the semiconductor wafer is done.