Invention Application
- Patent Title: CHEMICAL MECHANICAL POLISHING WITH NAPPED POROMERIC
- Patent Title (中): 化学机械抛光与复合材料
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Application No.: US11923544Application Date: 2007-10-24
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Publication No.: US20080076330A1Publication Date: 2008-03-27
- Inventor: Manoocher Birang , Lawrence Rosenberg , Sasson Somekh , John White
- Applicant: Manoocher Birang , Lawrence Rosenberg , Sasson Somekh , John White
- Applicant Address: US CA Santa Clara 95054
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara 95054
- Main IPC: B24B1/00
- IPC: B24B1/00
Abstract:
A method of polishing a substrate includes polishing a substrate with a generally linear polishing sheet, polishing the substrate with polishing pad composed of a napped poromeric material, and conditioning the polishing pad.
Information query
