Invention Application
- Patent Title: Sterilizing cutting system
- Patent Title (中): 灭菌切割系统
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Application No.: US11526193Application Date: 2006-09-22
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Publication No.: US20080077145A1Publication Date: 2008-03-27
- Inventor: Edward S. Boyden , Roderick A. Hyde , Muriel Y. Ishikawa , Eric C. Leuthardt , Nathan P. Myhrvold , Dennis J. Rivet , Michael A. Smith , Thomas A. Weaver , Lowell L. Wood
- Applicant: Edward S. Boyden , Roderick A. Hyde , Muriel Y. Ishikawa , Eric C. Leuthardt , Nathan P. Myhrvold , Dennis J. Rivet , Michael A. Smith , Thomas A. Weaver , Lowell L. Wood
- Assignee: Searete LLC, a limited liability corporation of the State of Delaware
- Current Assignee: Searete LLC, a limited liability corporation of the State of Delaware
- Main IPC: E04H1/00
- IPC: E04H1/00
Abstract:
Sectioning tools that emit self-sterilizing radiation. In one approach, the radiation is ultraviolet and/or plasmonic.
Information query
