发明申请
- 专利标题： Stack type semiconductor device package
- 专利标题（中）： 堆叠式半导体器件封装
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申请号： US11636985申请日： 2006-12-12
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公开(公告)号： US20080079133A1公开(公告)日： 2008-04-03
- 发明人: Chang-Young Park
- 申请人： Chang-Young Park
- 优先权： KR2006-97468 20061003
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A stack type semiconductor device package is disclosed having first and second semiconductor device packages mounted in a mirror arrangement on opposing first and second surfaces of an interposer, wherein the first and second semiconductor device packages and the first and second surfaces of the interposer are, respectively, adapted for connection using a land grid array method.
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