Disclosed is a camera module and a method of manufacture. The camera module includes a ceramic printed circuit board having a recess formed on its upper surface, an image sensor seated in the recess, a flexible printed circuit board positioned on the image sensor and electrically connected to the image sensor and a cap seated on the ceramic printed circuit board, the cap having a lens system positioned on a surface facing the image sensor. A method for manufacturing the camera module includes the steps of flip-chip-bonding an image sensor to a lower portion of a flexible printed circuit board, forming a ceramic printed circuit board having a recess; mounting the image sensor in the recess of the ceramic printed circuit board and seating a cap on the ceramic printed circuit board.