Invention Application
- Patent Title: AIRFOIL COOLING CIRCUITS AND METHOD
- Patent Title (中): 空气冷却电路和方法
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Application No.: US11062001Application Date: 2005-02-21
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Publication No.: US20080080979A1Publication Date: 2008-04-03
- Inventor: Steven Robert Brassfield , Ching-Pang Lee , Roger Lee Doughty , Richard William Jendrix , Cory Michael Williams
- Applicant: Steven Robert Brassfield , Ching-Pang Lee , Roger Lee Doughty , Richard William Jendrix , Cory Michael Williams
- Applicant Address: US NY Schenectady
- Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee Address: US NY Schenectady
- Main IPC: F01D5/18
- IPC: F01D5/18

Abstract:
An airfoil is disclosed having at least first and second cast, axially-stacked internal airflow cooling circuits. Each circuit defines multiple air flow passages positioned laterally between a pressure sidewall side and a suction sidewall side of respective ones of the circuits. Each of the circuits is formed by a separate casting core. Methods of forming a axially-stacked core and an airfoil are also disclosed.
Public/Granted literature
- US07377746B2 Airfoil cooling circuits and method Public/Granted day:2008-05-27
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